An efficient 3D-IC on-chip test framework to embed TSV testing in memory BIST

Liang Che Li, Wen Hsuan Hsu, Kuen Jong Lee, Chun Lung Hsu

研究成果: Conference contribution

6 引文 斯高帕斯(Scopus)

摘要

TSV-based 3D-IC design can reduce the connection length of stacked ICs and enhance I/O bandwidth of heterogeneous integrated circuits. However the testing of 3D ICs is more complicated than that of 2D ICs. This paper presents an efficient on-chip 3D-IC test framework that can embed the test procedure of TSVs into the memory BIST process. By using the same test patterns generated from the memory BIST mechanism, the faults in both memories and TSVs can be detected simultaneously without extra time to test TSVs. The area overhead for on-chip testing can also be reduced significantly. Experimental results show that the proposed test framework can gain a good performance in test time reduction with very low area overhead penalty for a memory-logic stacked IC.

原文English
主出版物標題20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015
發行者Institute of Electrical and Electronics Engineers Inc.
頁面520-525
頁數6
ISBN(電子)9781479977925
DOIs
出版狀態Published - 2015 三月 11
事件2015 20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015 - Chiba, Japan
持續時間: 2015 一月 192015 一月 22

出版系列

名字20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015

Other

Other2015 20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015
國家Japan
城市Chiba
期間15-01-1915-01-22

    指紋

All Science Journal Classification (ASJC) codes

  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Control and Systems Engineering
  • Modelling and Simulation

引用此

Li, L. C., Hsu, W. H., Lee, K. J., & Hsu, C. L. (2015). An efficient 3D-IC on-chip test framework to embed TSV testing in memory BIST. 於 20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015 (頁 520-525). [7059059] (20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ASPDAC.2015.7059059