An efficient solution for wire sweep analysis in IC packaging

Jerry Su, Sheng Jye Hwang, Francis Su, Shou Kang Chen

研究成果: Article同行評審

10 引文 斯高帕斯(Scopus)

摘要

Various methodologies of wire sweep analysis have been introduced to get better prediction and matching the experimental measurements by many researchers. As more and more high pin-count packages (such as BGA, QFP) are used today, efficiency has become an important requirement besides accuracy for software used to predict wire sweep in IC packaging. This study introduces a newly developed wire sweep analysis solution (InPack), not only to meet the need of accuracy, but also enhance the efficiency for actual applications. It combines global flow analysis (C-MOLD) and structure analysis (ANSYS) to become a solution for general wire sweep analysis.

原文English
頁(從 - 到)139-143
頁數5
期刊Journal of Electronic Packaging, Transactions of the ASME
125
發行號1
DOIs
出版狀態Published - 2003

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 材料力學
  • 電腦科學應用
  • 電氣與電子工程

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