摘要
Various methodologies of wire sweep analysis have been introduced to get better prediction and matching the experimental measurements by many researchers. As more and more high pin-count packages (such as BGA, QFP) are used today, efficiency has become an important requirement besides accuracy for software used to predict wire sweep in IC packaging. This study introduces a newly developed wire sweep analysis solution (InPack), not only to meet the need of accuracy, but also enhance the efficiency for actual applications. It combines global flow analysis (C-MOLD) and structure analysis (ANSYS) to become a solution for general wire sweep analysis.
原文 | English |
---|---|
頁(從 - 到) | 139-143 |
頁數 | 5 |
期刊 | Journal of Electronic Packaging, Transactions of the ASME |
卷 | 125 |
發行號 | 1 |
DOIs | |
出版狀態 | Published - 2003 |
All Science Journal Classification (ASJC) codes
- 電子、光磁材料
- 材料力學
- 電腦科學應用
- 電氣與電子工程