An electroplating method for copper plane twin boundary manufacturing

Yu Sheng Wang, Wen Hsi Lee, Shih Chieh Chang, Jun Nan Nian, Ying Lang Wang

研究成果: Article同行評審

18 引文 斯高帕斯(Scopus)

摘要

A twin boundary is a special kind of grain boundary that plays an important role in the deformation process of nanocrystalline metals, as it may affect the migration of atoms and electrons in polycrystalline solids, resulting in different electrical and mechanical properties. In this study, plane twin structures were introduced into an electroplated copper film by an electroplating method that inserts an interlayer film with a very small current density (<3 mA/cm2). It was found that the small-current interlayer formed a demarcation line for copper grain growth, and enhanced the twin boundaries by self-annealing at room temperature. Based on this, a method was developed to manufacture multi-plane twin boundaries to improve electron migration. Transmission electron microscopy, focused ion beam analysis, and secondary ion mass spectrometry were employed to examine this interesting phenomenon.

原文English
頁(從 - 到)157-161
頁數5
期刊Thin Solid Films
544
DOIs
出版狀態Published - 2013 十月 1

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 表面和介面
  • 表面、塗料和薄膜
  • 金屬和合金
  • 材料化學

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