An experimental study on the effects of abrasive particle sizes on polishing phenomena

Yeau Ren Jeng, Pay Yau Huang

研究成果: Conference contribution

摘要

The effects of abrasive particle size on polishing phenomena during wafer planarization are investigated using a high precision polishing process test bench with in-situ measurement technology. The present experimental results are found to be comported with the experimental and theoretical data published previously. The current experimental outcomes can help to understand the polishing mechanism and develop the relating theoretical model.

原文English
主出版物標題Progress on Advanced Manufacture for Micro/Nano Technology 2005 - Proceedings of the 2005 International Conference on Advanced Manufacture
發行者Trans Tech Publications Ltd
頁面301-306
頁數6
版本PART 1
ISBN(列印)0878499903, 9780878499908
DOIs
出版狀態Published - 2006 1月 1
事件2005 International Conference on Advanced Manufacture, ICAM2005 - Taipei, R.O.C., Taiwan
持續時間: 2005 11月 282005 12月 2

出版系列

名字Materials Science Forum
號碼PART 1
505-507
ISSN(列印)0255-5476
ISSN(電子)1662-9752

Other

Other2005 International Conference on Advanced Manufacture, ICAM2005
國家/地區Taiwan
城市Taipei, R.O.C.
期間05-11-2805-12-02

All Science Journal Classification (ASJC) codes

  • 一般材料科學
  • 凝聚態物理學
  • 材料力學
  • 機械工業

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