An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

Shatil Haque, Kun Xing, Ray Lee Lin, Carlos T.A. Suchicital, Member Guo-Quan Lu

研究成果: Article同行評審

56 引文 斯高帕斯(Scopus)

摘要

Power electronics building blocks (PEBB's) are envisioned as integrated power modules consisting of power semiconductor devices, power integrated circuits, sensors, and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. At the Center for Power Electronics Systems, we developed a topology for a basic building block-a twoswitch two-diode half-bridge converter in totem-pole configuration with built-in gate-driver and protection circuitry, fiberoptic receiver/transmitter interface, and soft-switching capability. Based on the topology, a series of prototype modules, with 600 V, 3.3 kW rating, were fabricated using an innovative packaging technique developed for the program-metal posts interconnected parallel plate structure (MPIPPS). This new packaging technique uses direct attachment of bulk copper, not wire-bonding of fine aluminum wires, for interconnecting power devices. Electrical performance data of the packaged devices show that an air-cooled 15 kW inverter, operating from 400 V dc bus with 20 kHz switching frequency can be constructed by integrating three prototype modules, which is almost double of what could not be achieved with commercially packaged devices of the same rating.

原文English
頁(從 - 到)136-144
頁數9
期刊IEEE Transactions on Advanced Packaging
22
發行號2
DOIs
出版狀態Published - 1999

All Science Journal Classification (ASJC) codes

  • 電氣與電子工程

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