An inverse design method for optimizing design parameters of heat sink modules with encapsulated chip

Cheng Hung Huang, Wei Lun Chang

研究成果: Article同行評審

18 引文 斯高帕斯(Scopus)

摘要

A three-dimensional inverse design problem in estimating the design variables for heat sink modules with an encapsulated chip is solved in the present study by using the Levenberg-Marquardt Method (LMM) and the general purpose commercial code CFD-ACE+ in an irregular domain. Three different types of heat sinks are examined at a fixed fin array volume to determine the most efficient type of heat sink. Moreover, Aluminum and Copper heat sinks are compared to find the optimum design of the module. Results obtained by using the LMM to solve this 3-D inverse design problem are justified based on the numerical experiments and it is concluded that the double row plate fin type heat sink performs best since it can obtain the lowest temperature distribution on the bottom surface of heat sink module. Moreover, larger heat transfer area of heat sink does not guarantee better thermal performance. Due to higher thermal conductivity of Copper heat sink, it also has better thermal performance than the Aluminum heat sink.

原文English
頁(從 - 到)216-226
頁數11
期刊Applied Thermal Engineering
40
DOIs
出版狀態Published - 2012 七月

All Science Journal Classification (ASJC) codes

  • Energy Engineering and Power Technology
  • Industrial and Manufacturing Engineering

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