Analysis for thermal conductance effect on the interfacial thermal stresses of anisotropic composites

Yui-Chuin Shiah, Yung Sen Lin, Y. H. Chen

研究成果: Article

1 引文 (Scopus)

摘要

The present work applies the regularized boundary integral equations that are newly developed to treat the thermoelastic field in thin anisotropic media. For the anisotropic thermal field, a direct domain mapping technique is applied with a unique interface condition that considers the heat conductance relation. By incorporating the heat conductance effect, the paper investigates how interfacial thermal stresses between generally anisotropic materials vary with the heat conductance coefficient. Accounting for the thermal conductance effect, the paper presents the complete algorithm for computing the thermal as well as the subsequent elastic fields on interfaces between dissimilarly adjoined anisotropic composites.

原文English
頁(從 - 到)991-1005
頁數15
期刊Journal of Thermal Stresses
31
發行號10
DOIs
出版狀態Published - 2008 十月 1

指紋

thermal stresses
Thermal stress
composite materials
Composite materials
heat
anisotropic media
integral equations
Anisotropic media
Boundary integral equations
Hot Temperature
coefficients

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics

引用此文

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Analysis for thermal conductance effect on the interfacial thermal stresses of anisotropic composites. / Shiah, Yui-Chuin; Lin, Yung Sen; Chen, Y. H.

於: Journal of Thermal Stresses, 卷 31, 編號 10, 01.10.2008, p. 991-1005.

研究成果: Article

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