Analysis of fatigue delamination growth in flip-chip package

Y. S. Lai, C. H. Chen, T. C. Chiu

研究成果: Article同行評審

5 引文 斯高帕斯(Scopus)

摘要

An incremental crack extension procedure is implemented for simulating the growth of an interface defect in an electronic flip-chip device subjected to fatigue temperature cycling. The distributions of fracture mechanics parameters including the strain energy release rate, the stress intensity factors and phase angles along the curvilinear front of an embedded corner defect on the interface of silicon die and underfill are estimated and substituted into a subcritical crack growth model to predict the evolution of the defect under cyclic loading condition. It is observed from the analysis that the corner defect is under crack faces contact condition during temperature cycling, and consequently, the delamination growth is under mode-II and mode-III driving forces. In addition, the crack growth rate is highest in the middle of the crack front, and the corner crack evolves from an initially concave front to a quarter-circular front under temperature cycling.

原文English
頁(從 - 到)2761-2773
頁數13
期刊Acta Mechanica
225
發行號10
DOIs
出版狀態Published - 2014 十月

All Science Journal Classification (ASJC) codes

  • Computational Mechanics
  • Mechanical Engineering

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