Analysis of Flip-Chip corner delamination using 3-D virtual crack closure technique

Tz Cheng Chiu; Huang Chun Lin; Hung Chun Yang

doi:10.1109/EMAP.2008.4784253

Analysis of Flip-Chip corner delamination using 3-D virtual crack closure technique

Tz Cheng Chiu, Huang Chun Lin, Hung Chun Yang

機械工程學系

研究成果: Conference contribution

2 引文斯高帕斯（Scopus）

摘要

The problem of an overmolded flip-chip containing a die-underfill interface corner crack subjected to thermomechanical loading is investigated by using finite element simulation. The fracture mechanics parameters including the stress intensity factors and strain energy release rate along the corner crack front are determined by using a three-dimensional virtual crack closure technique. Effect of the interface corner crack shape on the propensity of crack propagation is discussed.

原文	English
主出版物標題	2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
頁面	157-160
頁數	4
DOIs	https://doi.org/10.1109/EMAP.2008.4784253
出版狀態	Published - 2008
事件	2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 - Taipei, Taiwan 持續時間: 2008 10月 22 → 2008 10月 24

出版系列

名字	2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008

Other

Other	2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
國家/地區	Taiwan
城市	Taipei
期間	08-10-22 → 08-10-24

All Science Journal Classification (ASJC) codes

硬體和架構
電氣與電子工程
機械工業

存取文件

10.1109/EMAP.2008.4784253

其它文件與鏈接

引用此

Chiu, T. C., Lin, H. C., & Yang, H. C. (2008). Analysis of Flip-Chip corner delamination using 3-D virtual crack closure technique. 於 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 (頁 157-160). 文章 4784253 (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008). https://doi.org/10.1109/EMAP.2008.4784253

@inproceedings{122acd134d8a48d2acfc73ffd7cce394,

title = "Analysis of Flip-Chip corner delamination using 3-D virtual crack closure technique",

abstract = "The problem of an overmolded flip-chip containing a die-underfill interface corner crack subjected to thermomechanical loading is investigated by using finite element simulation. The fracture mechanics parameters including the stress intensity factors and strain energy release rate along the corner crack front are determined by using a three-dimensional virtual crack closure technique. Effect of the interface corner crack shape on the propensity of crack propagation is discussed.",

author = "Chiu, {Tz Cheng} and Lin, {Huang Chun} and Yang, {Hung Chun}",

year = "2008",

doi = "10.1109/EMAP.2008.4784253",

language = "English",

isbn = "9781424436217",

series = "2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008",

pages = "157--160",

booktitle = "2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008",

note = "2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 ; Conference date: 22-10-2008 Through 24-10-2008",

}

Chiu, TC, Lin, HC & Yang, HC 2008, Analysis of Flip-Chip corner delamination using 3-D virtual crack closure technique. 於 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008., 4784253, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, 頁 157-160, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, Taipei, Taiwan, 08-10-22. https://doi.org/10.1109/EMAP.2008.4784253

Analysis of Flip-Chip corner delamination using 3-D virtual crack closure technique. / Chiu, Tz Cheng; Lin, Huang Chun; Yang, Hung Chun.
2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. 2008. p. 157-160 4784253 (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008).

研究成果: Conference contribution

TY - GEN

T1 - Analysis of Flip-Chip corner delamination using 3-D virtual crack closure technique

AU - Chiu, Tz Cheng

AU - Lin, Huang Chun

AU - Yang, Hung Chun

PY - 2008

Y1 - 2008

N2 - The problem of an overmolded flip-chip containing a die-underfill interface corner crack subjected to thermomechanical loading is investigated by using finite element simulation. The fracture mechanics parameters including the stress intensity factors and strain energy release rate along the corner crack front are determined by using a three-dimensional virtual crack closure technique. Effect of the interface corner crack shape on the propensity of crack propagation is discussed.

AB - The problem of an overmolded flip-chip containing a die-underfill interface corner crack subjected to thermomechanical loading is investigated by using finite element simulation. The fracture mechanics parameters including the stress intensity factors and strain energy release rate along the corner crack front are determined by using a three-dimensional virtual crack closure technique. Effect of the interface corner crack shape on the propensity of crack propagation is discussed.

UR - http://www.scopus.com/inward/record.url?scp=64049118520&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=64049118520&partnerID=8YFLogxK

U2 - 10.1109/EMAP.2008.4784253

DO - 10.1109/EMAP.2008.4784253

M3 - Conference contribution

AN - SCOPUS:64049118520

SN - 9781424436217

T3 - 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008

SP - 157

EP - 160

BT - 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008

T2 - 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008

Y2 - 22 October 2008 through 24 October 2008

ER -

Analysis of Flip-Chip corner delamination using 3-D virtual crack closure technique

摘要

出版系列

Other

All Science Journal Classification (ASJC) codes

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其它文件與鏈接

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