Analysis of the residual stresses in the process of nanoimprint lithography

研究成果: Article同行評審

2 引文 斯高帕斯(Scopus)

摘要

Nanoimprint lithography has attracted broad interest as a low cost method to define nanometer scale patterns in recent years. In the cooling stage of the nanoimprint lithography process, the polymer resist is constrained inside the tool. As the temperature decreases, the polymer may shrink away from the tool. However, due to the constraint of the tool, thermal stresses may be induced in the polymer while the relaxation effect tends to release the build up of the stress level at the same time. In this study, a visco-elastic model was developed to analyze the stress variations of the imprinted patterns during the cooling process. Most of the residual stress is found to concentrate on the interface between the polymer resist and the substrate. Also, some stress concentration areas are observed near the adjacent of the large un-patterned area and the pillar. Thermal stress above the glass transition point is demonstrated to be able to relax during the cooling process. Most of the residual stresses are induced at the cooling stage with a temperature lower than the glass transition point.

原文English
頁(從 - 到)290-294
頁數5
期刊International Polymer Processing
21
發行號3
DOIs
出版狀態Published - 2006 七月

All Science Journal Classification (ASJC) codes

  • 化學工程 (全部)
  • 聚合物和塑料
  • 工業與製造工程
  • 材料化學

指紋

深入研究「Analysis of the residual stresses in the process of nanoimprint lithography」主題。共同形成了獨特的指紋。

引用此