Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress

Wei Yu Chen, Tsung Chieh Chiu, Kwang Lung Lin, Albert T. Wu, Wei Luen Jang, Chung Li Dong, Hsin Yi Lee

研究成果: Article同行評審

20 引文 斯高帕斯(Scopus)

摘要

The microstructural evolution of the intermetallic compound (Cu 6Sn5) in Sn-xCu solder matrix under current stress was investigated by scanning electron microscopy (SEM) and in situ synchrotron X-ray diffraction (XRD). The phase evolution of the Cu6Sn5 was also investigated under thermal aging for comparison. The only XRD crystalline peak (3̄14) of Cu6Sn5 that was detected disappeared under current stress, but not under thermal aging. Ex situ SEM observation of the Cu6Sn5 crystal revealed an anisotropic dissolution behavior. The kinetics of the anisotropic dissolution was also investigated.

原文English
頁(從 - 到)317-320
頁數4
期刊Scripta Materialia
68
發行號5
DOIs
出版狀態Published - 2013 三月

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

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