Annealing effect and tensile interface fracture mechanism of pure silver bonding wires

  • Hao Wen Hsueh
  • , Fei Yi Hung
  • , Truan Sheng Lui
  • , Li Hui Chen

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

指紋

深入研究「Annealing effect and tensile interface fracture mechanism of pure silver bonding wires」主題。共同形成了獨特的指紋。

Keyphrases

Engineering

Material Science