Application of chemical-mechanical polishing for planarizing a high-K nano-composite polyimide insulator used in organic thin film transistors

Wen Hsi Lee, Chun Chieh Wang, J. C. Ho

研究成果: Conference contribution

指紋 深入研究「Application of chemical-mechanical polishing for planarizing a high-K nano-composite polyimide insulator used in organic thin film transistors」主題。共同形成了獨特的指紋。

Engineering & Materials Science