Application of dynamic masking on rapid prototyping

Chien Nan Chen, Sheng Jye Hwang, Huei Huang Lee, Dum Yuan Huang

研究成果: Conference contribution

摘要

In rapid prototyping (RP) technologies, curing of UV-curable photopolymers is mainly achieved by the application of laser scanning with limited fabrication speed. The dynamic masking approach can improve the fabrication speed; however, current researches and available systems cure photopolymers with visible light rather than UV light. In this research, we have attempted to develop a UV dynamic masking RP system by implementing digital micro-mirror device (DMD) from digital light processing (DLP) technology and TFT liquid crystal display (LCD) panel. A DLP projector was disassembled and the main components were then recombined to form a dynamic mask generator. Thus, this study has shown the feasibility of obtaining a UV dynamic masking RP system that may be integrated for a UV-curable material processing.

原文English
主出版物標題Advanced Manufacture
主出版物子標題Focusing on New and Emerging Technologies - Selected, peer Reviewed Papers from the 2007 International Conference on Advanced Manufacture
發行者Trans Tech Publications Ltd
頁面261-272
頁數12
ISBN(電子)978-0-87849-360-9
出版狀態Published - 2008 一月 1
事件2007 SME International Conference on Advanced Manufacture, SME ICAM 2007 - Tainan, Taiwan
持續時間: 2008 十一月 262008 十一月 28

出版系列

名字Materials Science Forum
594
ISSN(列印)0255-5476
ISSN(電子)1662-9752

Other

Other2007 SME International Conference on Advanced Manufacture, SME ICAM 2007
國家Taiwan
城市Tainan
期間08-11-2608-11-28

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • 引用此

    Chen, C. N., Hwang, S. J., Lee, H. H., & Huang, D. Y. (2008). Application of dynamic masking on rapid prototyping. 於 Advanced Manufacture: Focusing on New and Emerging Technologies - Selected, peer Reviewed Papers from the 2007 International Conference on Advanced Manufacture (頁 261-272). (Materials Science Forum; 卷 594). Trans Tech Publications Ltd.