An image quality based method was applied to quantitatively analyse the contribution of electrodeposited copper twinning. This method, based on the image quality as obtained from electron backscattering diffraction, involves three processes: hexagonal edge detection, thinning algorithm and twin determination. The twin density determined by the new algorithm was 65.61% which is higher than the twin density, 57.44% as determined by the Orientation Imaging Microscopy (OIM) analysis. The newly developed algorithm provides an alternative to twin boundary detection.
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