Applications of LIGA on micro-punching process for metallic materials

C. T. Pan, P. J. Cheng, Sheng-Chih Shen, M. F. Chen, R. Y. Wang, M. C. Chou, T. C. Wu

研究成果: Conference contribution

2 引文 (Scopus)

摘要

This study presents an innovative imprinting method to fabricate IC devices by micro-punch process. Normally, imprinting method is used to imprint plastic materials such as photoresist and polymeric materials. In this study, imprinting process is applied to micro-punch metallic materials directly for IC devices. Fabrications of IC devices with high aspect ratio structures ranging from micrometer to sub-micrometer are described. In this study, to keep the production costs as low as possible, a complete micro-punching process is applied to replicate IC devices. A combination of lithography, extra-hard alloy nickel cobalt (Ni/Co) electroplating process (as a metal imprint mold for punch) and chemical mechanic polishing (CMP) process is used to flat the extra-hard alloy micro-punch head. It is worth noticing that the Ni-Co electroplating process with hardness over Hardness of Vicker (Hv) 560 is developed. With such hardness, it can stand the high pressure and abrasivness to confine the accuracy during micro-punching process. With regard to the electroplating process, Ni-Co is deposited and covered on the photoresist template uniformly by electroplating. The Ni/Co mold is served as master for micro-punching process to replicate the pattern onto polyimide (PI) or copper sheets. Finally, the experimental results are measured and characterized.

原文English
主出版物標題Progress on Advanced Manufacture for Micro/Nano Technology 2005 - Proceedings of the 2005 International Conference on Advanced Manufacture
頁面55-60
頁數6
版本PART 1
出版狀態Published - 2006 十二月 1
事件2005 International Conference on Advanced Manufacture, ICAM2005 - Taipei, R.O.C., Taiwan
持續時間: 2005 十一月 282005 十二月 2

出版系列

名字Materials Science Forum
號碼PART 1
505-507
ISSN(列印)0255-5476

Other

Other2005 International Conference on Advanced Manufacture, ICAM2005
國家Taiwan
城市Taipei, R.O.C.
期間05-11-2805-12-02

指紋

Punching
punches
electroplating
Electroplating
hardness
Hardness
Photoresists
Cobalt
photoresists
micrometers
cobalt
production costs
nickel alloys
Nickel alloys
high aspect ratio
Nickel
Polishing
polyimides
polishing
Polyimides

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

引用此文

Pan, C. T., Cheng, P. J., Shen, S-C., Chen, M. F., Wang, R. Y., Chou, M. C., & Wu, T. C. (2006). Applications of LIGA on micro-punching process for metallic materials. 於 Progress on Advanced Manufacture for Micro/Nano Technology 2005 - Proceedings of the 2005 International Conference on Advanced Manufacture (PART 1 編輯, 頁 55-60). (Materials Science Forum; 卷 505-507, 編號 PART 1).
Pan, C. T. ; Cheng, P. J. ; Shen, Sheng-Chih ; Chen, M. F. ; Wang, R. Y. ; Chou, M. C. ; Wu, T. C. / Applications of LIGA on micro-punching process for metallic materials. Progress on Advanced Manufacture for Micro/Nano Technology 2005 - Proceedings of the 2005 International Conference on Advanced Manufacture. PART 1. 編輯 2006. 頁 55-60 (Materials Science Forum; PART 1).
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abstract = "This study presents an innovative imprinting method to fabricate IC devices by micro-punch process. Normally, imprinting method is used to imprint plastic materials such as photoresist and polymeric materials. In this study, imprinting process is applied to micro-punch metallic materials directly for IC devices. Fabrications of IC devices with high aspect ratio structures ranging from micrometer to sub-micrometer are described. In this study, to keep the production costs as low as possible, a complete micro-punching process is applied to replicate IC devices. A combination of lithography, extra-hard alloy nickel cobalt (Ni/Co) electroplating process (as a metal imprint mold for punch) and chemical mechanic polishing (CMP) process is used to flat the extra-hard alloy micro-punch head. It is worth noticing that the Ni-Co electroplating process with hardness over Hardness of Vicker (Hv) 560 is developed. With such hardness, it can stand the high pressure and abrasivness to confine the accuracy during micro-punching process. With regard to the electroplating process, Ni-Co is deposited and covered on the photoresist template uniformly by electroplating. The Ni/Co mold is served as master for micro-punching process to replicate the pattern onto polyimide (PI) or copper sheets. Finally, the experimental results are measured and characterized.",
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Pan, CT, Cheng, PJ, Shen, S-C, Chen, MF, Wang, RY, Chou, MC & Wu, TC 2006, Applications of LIGA on micro-punching process for metallic materials. 於 Progress on Advanced Manufacture for Micro/Nano Technology 2005 - Proceedings of the 2005 International Conference on Advanced Manufacture. PART 1 edn, Materials Science Forum, 編號 PART 1, 卷 505-507, 頁 55-60, 2005 International Conference on Advanced Manufacture, ICAM2005, Taipei, R.O.C., Taiwan, 05-11-28.

Applications of LIGA on micro-punching process for metallic materials. / Pan, C. T.; Cheng, P. J.; Shen, Sheng-Chih; Chen, M. F.; Wang, R. Y.; Chou, M. C.; Wu, T. C.

Progress on Advanced Manufacture for Micro/Nano Technology 2005 - Proceedings of the 2005 International Conference on Advanced Manufacture. PART 1. 編輯 2006. p. 55-60 (Materials Science Forum; 卷 505-507, 編號 PART 1).

研究成果: Conference contribution

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AU - Pan, C. T.

AU - Cheng, P. J.

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AU - Wang, R. Y.

AU - Chou, M. C.

AU - Wu, T. C.

PY - 2006/12/1

Y1 - 2006/12/1

N2 - This study presents an innovative imprinting method to fabricate IC devices by micro-punch process. Normally, imprinting method is used to imprint plastic materials such as photoresist and polymeric materials. In this study, imprinting process is applied to micro-punch metallic materials directly for IC devices. Fabrications of IC devices with high aspect ratio structures ranging from micrometer to sub-micrometer are described. In this study, to keep the production costs as low as possible, a complete micro-punching process is applied to replicate IC devices. A combination of lithography, extra-hard alloy nickel cobalt (Ni/Co) electroplating process (as a metal imprint mold for punch) and chemical mechanic polishing (CMP) process is used to flat the extra-hard alloy micro-punch head. It is worth noticing that the Ni-Co electroplating process with hardness over Hardness of Vicker (Hv) 560 is developed. With such hardness, it can stand the high pressure and abrasivness to confine the accuracy during micro-punching process. With regard to the electroplating process, Ni-Co is deposited and covered on the photoresist template uniformly by electroplating. The Ni/Co mold is served as master for micro-punching process to replicate the pattern onto polyimide (PI) or copper sheets. Finally, the experimental results are measured and characterized.

AB - This study presents an innovative imprinting method to fabricate IC devices by micro-punch process. Normally, imprinting method is used to imprint plastic materials such as photoresist and polymeric materials. In this study, imprinting process is applied to micro-punch metallic materials directly for IC devices. Fabrications of IC devices with high aspect ratio structures ranging from micrometer to sub-micrometer are described. In this study, to keep the production costs as low as possible, a complete micro-punching process is applied to replicate IC devices. A combination of lithography, extra-hard alloy nickel cobalt (Ni/Co) electroplating process (as a metal imprint mold for punch) and chemical mechanic polishing (CMP) process is used to flat the extra-hard alloy micro-punch head. It is worth noticing that the Ni-Co electroplating process with hardness over Hardness of Vicker (Hv) 560 is developed. With such hardness, it can stand the high pressure and abrasivness to confine the accuracy during micro-punching process. With regard to the electroplating process, Ni-Co is deposited and covered on the photoresist template uniformly by electroplating. The Ni/Co mold is served as master for micro-punching process to replicate the pattern onto polyimide (PI) or copper sheets. Finally, the experimental results are measured and characterized.

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M3 - Conference contribution

AN - SCOPUS:35348912555

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Pan CT, Cheng PJ, Shen S-C, Chen MF, Wang RY, Chou MC 等. Applications of LIGA on micro-punching process for metallic materials. 於 Progress on Advanced Manufacture for Micro/Nano Technology 2005 - Proceedings of the 2005 International Conference on Advanced Manufacture. PART 1 編輯 2006. p. 55-60. (Materials Science Forum; PART 1).