Asymmetrical interfacial reactions of Ni/SAC101(NiIn)/Ni solder joint induced by current stressing

Chen Yi Lin, Tsung Chieh Chiu, Kwang Lung Lin

研究成果: Article同行評審

4 引文 斯高帕斯(Scopus)

摘要

An electric current can asymmetrically trigger either atomic migration or interfacial reactions between a cathode and an anode. The present study investigated the dissolution of metallization and formation of an interfacial intermetallic compound (IMC) in the Cu/Ni/Sn1.0Ag0.1Cu0.02Ni0.05In/Ni/Cu solder joint at various current densities in the order of 103 A/cm2 at temperatures ranging from 100 °C to 150 °C. The polarization behavior of Ni dissolution and IMC formation under current stressing were systematically investigated. The asymmetrical interfacial reactions of the solder joint were found to be greatly influenced by ambient temperature. The dissolution of Ni and its effect on interfacial IMC formation were also discussed.

原文English
文章編號115102
期刊Journal of Applied Physics
123
發行號11
DOIs
出版狀態Published - 2018 三月 21

All Science Journal Classification (ASJC) codes

  • 物理與天文學 (全部)

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