Atomic-scale simulations of material behaviors and tribology properties for FCC and BCC metal films

Cheng Da Wu, Te Hua Fang, Jen Fin Lin

研究成果: Article同行評審

20 引文 斯高帕斯(Scopus)

摘要

The material behaviors and tribology properties of face-centered cubic (FCC) and body-centered cubic (BCC) metal films under nanocontact with a scanning probe tip are studied using molecular dynamics simulations. The results clearly show that for a given indentation depth, the required indentation force increases with atomic bonding energy. During scratching, the chips (removed atoms) pile up in front of the probe tip due to adhesion. Most of the chips behind the probe tip disappear due to elastic relaxation and elastic recovery. A slip system clearly occurs in the <110> and <111> directions for FCC and BCC metal films, respectively. A material with higher atomic bonding energy exhibits a larger normal force, a larger friction force, and a lower friction coefficient.

原文English
頁(從 - 到)59-62
頁數4
期刊Materials Letters
80
DOIs
出版狀態Published - 2012 八月 1

All Science Journal Classification (ASJC) codes

  • 材料科學(全部)
  • 凝聚態物理學
  • 材料力學
  • 機械工業

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