Atomistic simulations of nanoindentation on Cu (111) with a void

Chung Ming Tan, Yeau Ren Jeng, Yung Chuan Chiou

研究成果: Conference contribution

摘要

This paper employs static atomistic simulations to investigate the effect of a void on the nanoindentation of Cu(111). The simulations minimize the potential energy of the complete system via finite element formulation to identify the equilibrium configuration of any deformed state. The size and depth of the void are treated as two variable parameters. The numerical results reveal that the void disappears when the indentation depth is sufficiently large. A stress concentration is observed at the internal surface of the void in all simulations cases. The results indicate that the presence of a void has a significant influence on the nanohardness extracted from the nanoindentation tests.

原文English
主出版物標題Advances in Fracture and Materials Behavior - Selected, peer reviewed papers of the Seventh International Conference on Fracture and Strength of Solids (FEOFS2007)
發行者Trans Tech Publications
頁面919-924
頁數6
ISBN(列印)0878493999, 9780878493999
DOIs
出版狀態Published - 2008
事件7th International Conference on Fracture and Strength of Solids, FEOFS 2007 - Urumqi, China
持續時間: 2007 八月 272007 八月 29

出版系列

名字Advanced Materials Research
33-37 PART 2
ISSN(列印)1022-6680

Other

Other7th International Conference on Fracture and Strength of Solids, FEOFS 2007
國家/地區China
城市Urumqi
期間07-08-2707-08-29

All Science Journal Classification (ASJC) codes

  • 工程 (全部)

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