TY - JOUR
T1 - Back flash imprint lithography for transparent plastic substrates
AU - Liao, Wen Chang
AU - Hsu, Steve Lien Chung
AU - Chu, Sheng Yuan
AU - Kau, Po Ching
N1 - Funding Information:
The financial support provided by the Ministry of Economic Affairs (Taiwan, ROC) through project 91-EC-17-A-07-S1-0018 is greatly appreciated. We also thank the Center for Micro-NanoTechnology, National Cheng-Kung University for providing Single-Side Mask Aligner (OAI, J500).
PY - 2005/7/1
Y1 - 2005/7/1
N2 - A new and low-cost process, back flash imprint lithography (BFIL), has been developed for use in resist pattern transfer on flexible transparent plastic substrates. This technique uses a two-layer plate, which contains a transparent plastic substrate coated with an UV-curable resist. The plate is heated over the resist's softening point. Then a non-transparent mold is pressed to the resist layer. After cooling to room temperature, an UV-light is applied from the substrate side to photocure the resist. After the separation of mold and the resist layer, the desired patterns can be transferred to the resist completely.
AB - A new and low-cost process, back flash imprint lithography (BFIL), has been developed for use in resist pattern transfer on flexible transparent plastic substrates. This technique uses a two-layer plate, which contains a transparent plastic substrate coated with an UV-curable resist. The plate is heated over the resist's softening point. Then a non-transparent mold is pressed to the resist layer. After cooling to room temperature, an UV-light is applied from the substrate side to photocure the resist. After the separation of mold and the resist layer, the desired patterns can be transferred to the resist completely.
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U2 - 10.1016/j.mee.2004.11.003
DO - 10.1016/j.mee.2004.11.003
M3 - Article
AN - SCOPUS:15344344657
SN - 0167-9317
VL - 77
SP - 250
EP - 254
JO - Microelectronic Engineering
JF - Microelectronic Engineering
IS - 3-4
ER -