Barrier metallization technique on copper substrates for soldering applications

William W. So, Selah Choe, Wen-Kuei Chuang, Chin C. Lee

研究成果: Article同行評審

2 引文 斯高帕斯(Scopus)

摘要

A metallization process to produce a composite barrier layer on copper substrates is presented. Barrier effectiveness is tested using indium as the solder medium. Bonded samples are evaluated using scanning electron microscope (SEM) with energy dispersive X-ray (EDX).

原文English
頁(從 - 到)855-860
頁數6
期刊Proceedings - Electronic Components and Technology Conference
出版狀態Published - 2000

All Science Journal Classification (ASJC) codes

  • 電氣與電子工程

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