Board-level reliability of coreless flip chip package assembled on a printed circuit board

Tao Chih Chang, Jin Ye Juang, Hung Jen Chang, Chun Chih Chuang, Chau Jie Zhan, Yin Po Hung, Tsung Fu Yang, Wei Li, Su Ching Chung, Jung Hua Chou

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

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Engineering & Materials Science

Chemical Compounds