Bonding and failure behaviors of ACA flip chip bumps

Kwang Lung Lin, Wei Liang Chen, Charles Hwang

研究成果: Article同行評審

2 引文 斯高帕斯(Scopus)

摘要

An anisotropic conductive adhesive (ACA) bump was produced on a silicon chip for bonding onto a glass substrate. The bumping process and the bonding procedure are described. The constituents of the ACA were investigated with a scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS). The thermal behavior of the ACA was investigated with differential scanning calorimetry (DSC). The spherical conductive nickel particles were deformed after bonding, while the silica filler was not. The reliability of the ACA bonding was tested at 85'C/85% relative humidity. The failure behavior of the ACA bonding was further investigated. A suitable height of the metal bonding pad was recommended.

原文English
頁(從 - 到)119-131
頁數13
期刊International Journal of Microcircuits and Electronic Packaging
25
發行號1
出版狀態Published - 2005

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 安全、風險、可靠性和品質
  • 電氣與電子工程

指紋

深入研究「Bonding and failure behaviors of ACA flip chip bumps」主題。共同形成了獨特的指紋。

引用此