Bonding fracture mechanism between Sn-Pb solder and electroless nickel-alloy deposits

Chwan Ying Lee, Kwang Lung Lin

研究成果: Paper同行評審

2 引文 斯高帕斯(Scopus)

摘要

The present study investigated the fracture mechanism of solder bumps consisting of Al/electroless Ni alloy/Sn-Pb combination. The intermetallic compounds formed at the interface were Ni3Sn4 at 150 °C, and Ni3Sn2 and Ni3Sn4 phases formed at 250 °C for all electroless nickel-alloy deposits. Experimental results showed that the adhesion strength of the above bump is lowered at longer soldering time and higher temperature. On the basis of the observation of the fracture surface, the fracture modes were classified into three types. The type I fracture takes place at the bulk solder which occurred when the sample was soldered at 250 °C for less than 30 seconds. The second type of fracture occurred within the intermetallic compound layer when the sample was soldered at 250 °C for 5 minutes or heat treated at 150 °C for 1000 hours. The type III fracture occurred at the Ni-Cu-P/Al interface when soldered at 300 °C for 20 minutes.

原文English
頁面1081-1099
頁數19
出版狀態Published - 1995 一月 1
事件Proceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2) - Maui, HI, USA
持續時間: 1995 三月 261995 三月 30

Other

OtherProceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2)
城市Maui, HI, USA
期間95-03-2695-03-30

All Science Journal Classification (ASJC) codes

  • 機械工業
  • 電氣與電子工程

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