BSIM-IMG: A Turnkey compact model for fully depleted technologies

Chenming Hu, Ali Niknejad, V. Sriramkumar, Darsen Lu, Yogesh Chauhan, Muhammed Kahm, Angada Sachid

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

摘要

BSIM-IMG is a Turnkey, Production Ready model Will be submitted to the CMC for standardization Physical, Scalable Core Model for FDSOI devices Plethora of Real Device Effects modeled Advanced Device Effects-Quantum, Back-gate bias, Self-heating Validated on Hardware Data from two FDSOI/UTBSOI technologies Available in major EDA tools.

原文English
主出版物標題2012 IEEE International SOI Conference, SOI 2012
DOIs
出版狀態Published - 2012
事件2012 IEEE International SOI Conference, SOI 2012 - Napa, CA, United States
持續時間: 2012 十月 12012 十月 4

出版系列

名字Proceedings - IEEE International SOI Conference
ISSN(列印)1078-621X

Other

Other2012 IEEE International SOI Conference, SOI 2012
國家/地區United States
城市Napa, CA
期間12-10-0112-10-04

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 電氣與電子工程

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