Building materials effects of al content and physical properties on the electromagnetic interference shielding of sn based coating thin layers

Fei Shuo Hung, Fei-Yi Hung, Che Ming Chiang, Truan-Sheng Lui

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

This study coats complex colloid mixed with Sn-xAl powders and polyethylene on glass to examine the shield effect on electromagnetic interference (EMI). In addition, the sputtering specimens and powder coating specimens were compared. The results show that adding Al to the Sn-xAl powders can increase the electromagnetic interference (EMI) shield at lower frequencies. Notably, the number of cavities in the coating layer increased with the coating thickness, with the result that the EMI shield could not improve with an increase in the coating thickness at higher frequencies. However, the EMI shield of sputtering films had a tendency to increase as the thin thickness increased. The Sn-40Al undergoes a dispersing effect which forms a fine overlapping structure, thereby improving the low frequency EMI shielding. In addition, the Sn-20Al powders possessed the properties of a small particle size, closed structure and higher electric conductivity which improved the high frequency EMI shielding. For the sputtering films, the annealed treatment not only had higher electric conductivity but also increased the high frequency EMI shielding.

原文English
主出版物標題Intelligent Materials, Applied Mechanics and Design Science, IMAMD2011
頁面142-151
頁數10
版本3
DOIs
出版狀態Published - 2012 一月 1
事件2011 International Conference on Intelligent Materials, Applied Mechanics and Design Science, IMAMD2011 - Beijing, China
持續時間: 2011 十二月 242011 十二月 25

出版系列

名字Applied Mechanics and Materials
號碼3
142
ISSN(列印)1660-9336
ISSN(電子)1662-7482

Other

Other2011 International Conference on Intelligent Materials, Applied Mechanics and Design Science, IMAMD2011
國家China
城市Beijing
期間11-12-2411-12-25

    指紋

All Science Journal Classification (ASJC) codes

  • Engineering(all)

引用此

Hung, F. S., Hung, F-Y., Chiang, C. M., & Lui, T-S. (2012). Building materials effects of al content and physical properties on the electromagnetic interference shielding of sn based coating thin layers. 於 Intelligent Materials, Applied Mechanics and Design Science, IMAMD2011 (3 編輯, 頁 142-151). (Applied Mechanics and Materials; 卷 142, 編號 3). https://doi.org/10.4028/www.scientific.net/AMM.142.142