Reductions in feature size and function integration require either replacement or modification of existing interconnect materials to fit ever advancing technology. Due to their remarkable properties, carbon nanotubes (CNTs) are selected as candidates for future interconnect material. It is hopeful to help move the Moore’s law further since it is presently hindered by the current Cu- and Si-based technologies. The present paper serves as a compendium of research work on the application of CNTs for interconnection applications.
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