摘要
Reductions in feature size and function integration require either replacement or modification of existing interconnect materials to fit ever advancing technology. Due to their remarkable properties, carbon nanotubes (CNTs) are selected as candidates for future interconnect material. It is hopeful to help move the Moore’s law further since it is presently hindered by the current Cu- and Si-based technologies. The present paper serves as a compendium of research work on the application of CNTs for interconnection applications.
| 原文 | English |
|---|---|
| 頁(從 - 到) | 643-662 |
| 頁數 | 20 |
| 期刊 | Journal of Materials Science |
| 卷 | 52 |
| 發行號 | 2 |
| DOIs | |
| 出版狀態 | Published - 2017 1月 1 |
All Science Journal Classification (ASJC) codes
- 材料力學
- 陶瓷和複合材料
- 機械工業
- 聚合物和塑料
- 一般材料科學
- 材料科學(雜項)
指紋
深入研究「Carbon nanotube-based interconnections」主題。共同形成了獨特的指紋。引用此
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