Characteristics of lock-in thermography signal from solder bump cracking in wafer-level chip scale packaging for internet of things applications

I. Chih Wu, Yu Jung Huang, Min Haw Wang, Ling Sheng Jang

研究成果: Article

指紋 深入研究「Characteristics of lock-in thermography signal from solder bump cracking in wafer-level chip scale packaging for internet of things applications」主題。共同形成了獨特的指紋。

Physics & Astronomy

Chemical Compounds

Engineering & Materials Science