Characterization of cure-dependent viscoelastic behavior for molding compound and application to package warpage simulation

Tz Cheng Chiu, Je Li Kung, Yi Shao Lai

研究成果: Conference contribution

4 引文 斯高帕斯(Scopus)

摘要

In this study a process-dependent viscoelastic model is developed for considering the constitutive relationship of an epoxy molding compound. The process dependence is realized by incorporating the phenomenological models for the cure kinetics, the cure-dependent volume shrinkage, and the cure-dependent viscoelastic stress relaxation modulus into the constitutive model for the molding compound. The cure-dependent viscoelastic model is incorporated into numerical finite element analysis to simulate warpage of an overmolded chip scale ball grid array (BGA) package under uniform cooling from reflow to room temperature. The simulation results are compared to Shadow Moiré experimental data for validating the modeling methodology. Additional finite element analyses are performed to investigate the influence of molding compound constitutive behavior (temperature-dependent elastic or viscoelastic) on the package warpage prediction, and to consider the package warpage evolution during the post-mold curing (PMC) process.

原文English
主出版物標題Proceedings of the ASME InterPack Conference 2009, IPACK2009
頁面9-17
頁數9
DOIs
出版狀態Published - 2010 六月 30
事件2009 ASME InterPack Conference, IPACK2009 - San Francisco, CA, United States
持續時間: 2009 七月 192009 七月 23

出版系列

名字Proceedings of the ASME InterPack Conference 2009, IPACK2009
2

Other

Other2009 ASME InterPack Conference, IPACK2009
國家/地區United States
城市San Francisco, CA
期間09-07-1909-07-23

All Science Journal Classification (ASJC) codes

  • 硬體和架構
  • 電氣與電子工程

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