Characterization of fine-pitch solder bump joint and package warpage for low K high-pin-count flip-chip BGA through Shadow Moiré and Micro Moiré techniques
- An Hong Liu
- , David W. Wang
- , Hsiang Ming Huang
- , Ming Sun
- , Muh Ren Lin
- , Chonghua Zhong
- , Sheng Jye Hwang
- , Hsuan Heng Lu
研究成果: Conference contribution
10
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引文
斯高帕斯（Scopus）