Characterization of Sn2.4Ag solder viscoplastic behavior under cyclic loading

H. C. Yang, T. C. Chiu

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

摘要

A series of monotonic and cyclic experiments, including constant strain-rate, creep and cyclic loading tests at isothermal temperatures between 25°C and 150°C, were performed to characterize the viscoplastic behavior of Pb-free Sn2.4Ag solder. The constitutive model of the solder was developed by fitting the monotonic test results to the Anand viscoplastic model. Finite element model based on the Anand constitutive model was then applied to simulate solder responses under various cyclic loading histories, and compared to the experimental results. From the comparison it was observed that the Anand model reproduces the isotropic hardening behavior of the Sn2.4Ag solder; but as a result of lacking tensorial state variable, the model could not capture the kinematic hardening response under load reversal. Nevertheless, the thermal recovery behavior of the Sn2.4Ag solder is limited under cyclic creep loading, and the Anand model is still suitable for predicting the Sn2.4Ag solder response under low-stress cyclic loading conditions.

原文English
主出版物標題Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
頁面863-869
頁數7
DOIs
出版狀態Published - 2012
事件13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012 - San Diego, CA, United States
持續時間: 2012 五月 302012 六月 1

出版系列

名字InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
ISSN(列印)1936-3958

Other

Other13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
國家/地區United States
城市San Diego, CA
期間12-05-3012-06-01

All Science Journal Classification (ASJC) codes

  • 控制與系統工程
  • 電氣與電子工程

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