Characterizations of Cu/Sn-Zn solder/Ag interfaces on photovoltaic ribbon for silicon solar cells

Kuan Jen Chen, Fei Yi Hung, Truan Sheng Lui, Li Hui Chen, Yu Wen Chen

研究成果: Article同行評審

10 引文 斯高帕斯(Scopus)

摘要

Sn-xZn (x = 9, 25, and 50 wt%) alloy solders are applied in photovoltaic (PV) ribbon and connected with silicon solar cells. The interfacial microstructures, series resistance, and bonding strength of Sn-xZn PV modules are investigated. Cu 5Zn8 and AgZn3 intermetallic compounds (IMCs) were found at the interfaces. The Zn content in the solder dominates the growth behavior of IMCs at the interface. The thickness of the Cu5Zn 8 and AgZn3 IMC layer increased with increasing Zn content in the solder, and thus, the series resistance of the PV module also increased. The growth of IMCs can enhance the interfacial adhesion strength, but excess Zn overconsumes the Ag electrode, reducing the bond strength of the PV module. Applying low-Zn-content Sn-xZn solder to PV ribbon avoids overconsumption of the Ag layer and, thus, decreases the series resistance and internal stress.

原文English
文章編號6979227
頁(從 - 到)202-205
頁數4
期刊IEEE Journal of Photovoltaics
5
發行號1
DOIs
出版狀態Published - 2015 一月 1

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 凝聚態物理學
  • 電氣與電子工程

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