Computer-Aided design of a TSOP II LOC package using Taguchi's parameter design method to optimize mold-flow balance

Hung Lung Lee, Shyang Jye Chang, Sheng Jye Hwang, Francis Su, S. K. Chen

研究成果: Article同行評審

16 引文 斯高帕斯(Scopus)

摘要

This paper presents a methodology for TSOP II LOC packaging design. The design objectives are: 1) to optimize mold-flow balance, which in turn minimizes air traps, and 2) to minimize manufacturing variability which implies optimal quality. A mold-flow simulation tool called C-MOLD is used to evaluate various design configurations. Taguchi's robust design method is used for manufacturing variability considerations. The simulated results are verified with experimental flow patterns produced by means of "short shots." In the nomenclature of the Taguchi method, mold-flow balance was chosen as quality characteristics and select a set of design parameters called control factors. The objectives are to find the levels of the control factors, which optimize the flow balance, and, at the same time, minimize the sensitivity of the variations of the control factors.

原文English
頁(從 - 到)268-275
頁數8
期刊Journal of Electronic Packaging, Transactions of the ASME
125
發行號2 SPEC.
DOIs
出版狀態Published - 2003 六月

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 材料力學
  • 電腦科學應用
  • 電氣與電子工程

指紋

深入研究「Computer-Aided design of a TSOP II LOC package using Taguchi's parameter design method to optimize mold-flow balance」主題。共同形成了獨特的指紋。

引用此