Contact photolithography at sub-micrometer scale using a soft photomask

Chun Ying Wu, Heng Hsieh, Yung-Chun Lee

研究成果: Article

摘要

This paper proposes a method for improving the patterning resolution of conventional contact photolithography from the micrometer, down to the sub-micrometer scale. The key element is a soft polydimethylsiloxane (PDMS) photomask, which is first replicated from a silicon mold and then patterned with a black photoresist (PR) layer to selectively block ultraviolet (UV) light. This soft PDMS photomask can easily form an intimate and conformable contact with a PR-coated substrate and hence can perform contact photolithography with high pattern resolution. The fabrication processes of this black-PR/PDMS soft photomask are experimentally carried out. Using the fabricated soft photomask, UV patterning by contact photolithography with the smallest line-width of 170 nm over a 4" wafer area was successfully achieved. The advantages and potentials of this new type of contact photolithography will be addressed.

原文English
文章編號547
期刊Micromachines
10
發行號8
DOIs
出版狀態Published - 2019 八月 1

指紋

Photomasks
Photolithography
Polydimethylsiloxane
Photoresists
Linewidth
Fabrication
Silicon
Substrates

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

引用此文

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Contact photolithography at sub-micrometer scale using a soft photomask. / Wu, Chun Ying; Hsieh, Heng; Lee, Yung-Chun.

於: Micromachines, 卷 10, 編號 8, 547, 01.08.2019.

研究成果: Article

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