摘要
In this paper, two types of contact-printing methods for micro/nano-lithography are developed and their application on fabricating high-frequency surface acoustic wave (SAW) devices are investigated. First of all, a Light-Assisted Metal Film Patterning (LAMP) method which transfers a patterned metal film directly from a silicon mold to a substrate is discussed. The pattern transformation relies on both mechanical contact pressure and optical heating at the interface. Metal patterns with 100 nm feature size can be easily transferred in laboratory using simple equipments. Secondly, a Contact-Transfer and Mask-Embedded Lithography (CMEL) is proposed which cleverly arranges pure mechanical forces and surface energy difference to achieve the patterning of nano-structures on various kinds of substrates. Applications of these two developed methods are demonstrated on the fabrication of high-frequency (∼2 GHz) surface acoustic wave (SAW) filters and resonators. Future developments and potential applications of these nanoimprinting and nano-patterning methods will be addressed.
| 原文 | English |
|---|---|
| 主出版物標題 | ICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings |
| 頁面 | 2456-2459 |
| 頁數 | 4 |
| DOIs | |
| 出版狀態 | Published - 2008 十二月 1 |
| 事件 | 2008 9th International Conference on Solid-State and Integrated-Circuit Technology, ICSICT 2008 - Beijing, China 持續時間: 2008 十月 20 → 2008 十月 23 |
出版系列
| 名字 | International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT |
|---|
Other
| Other | 2008 9th International Conference on Solid-State and Integrated-Circuit Technology, ICSICT 2008 |
|---|---|
| 國家 | China |
| 城市 | Beijing |
| 期間 | 08-10-20 → 08-10-23 |
指紋
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
- Condensed Matter Physics
- Electronic, Optical and Magnetic Materials
引用此文
}
Contact printing of metallic pattern and its applications on fabricating high-frequency surface acoustic wave (SAW) devices. / Lee, Yung Chun; Chen, Chun Hung; Chen, Hsueh Liang; Liu, Chin Hsin; Chiu, Cheng Yu; Lin, Hung Yi.
ICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings. 2008. p. 2456-2459 4735086 (International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT).研究成果: Conference contribution
TY - GEN
T1 - Contact printing of metallic pattern and its applications on fabricating high-frequency surface acoustic wave (SAW) devices
AU - Lee, Yung Chun
AU - Chen, Chun Hung
AU - Chen, Hsueh Liang
AU - Liu, Chin Hsin
AU - Chiu, Cheng Yu
AU - Lin, Hung Yi
PY - 2008/12/1
Y1 - 2008/12/1
N2 - In this paper, two types of contact-printing methods for micro/nano-lithography are developed and their application on fabricating high-frequency surface acoustic wave (SAW) devices are investigated. First of all, a Light-Assisted Metal Film Patterning (LAMP) method which transfers a patterned metal film directly from a silicon mold to a substrate is discussed. The pattern transformation relies on both mechanical contact pressure and optical heating at the interface. Metal patterns with 100 nm feature size can be easily transferred in laboratory using simple equipments. Secondly, a Contact-Transfer and Mask-Embedded Lithography (CMEL) is proposed which cleverly arranges pure mechanical forces and surface energy difference to achieve the patterning of nano-structures on various kinds of substrates. Applications of these two developed methods are demonstrated on the fabrication of high-frequency (∼2 GHz) surface acoustic wave (SAW) filters and resonators. Future developments and potential applications of these nanoimprinting and nano-patterning methods will be addressed.
AB - In this paper, two types of contact-printing methods for micro/nano-lithography are developed and their application on fabricating high-frequency surface acoustic wave (SAW) devices are investigated. First of all, a Light-Assisted Metal Film Patterning (LAMP) method which transfers a patterned metal film directly from a silicon mold to a substrate is discussed. The pattern transformation relies on both mechanical contact pressure and optical heating at the interface. Metal patterns with 100 nm feature size can be easily transferred in laboratory using simple equipments. Secondly, a Contact-Transfer and Mask-Embedded Lithography (CMEL) is proposed which cleverly arranges pure mechanical forces and surface energy difference to achieve the patterning of nano-structures on various kinds of substrates. Applications of these two developed methods are demonstrated on the fabrication of high-frequency (∼2 GHz) surface acoustic wave (SAW) filters and resonators. Future developments and potential applications of these nanoimprinting and nano-patterning methods will be addressed.
UR - http://www.scopus.com/inward/record.url?scp=60649096977&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=60649096977&partnerID=8YFLogxK
U2 - 10.1109/ICSICT.2008.4735086
DO - 10.1109/ICSICT.2008.4735086
M3 - Conference contribution
AN - SCOPUS:60649096977
SN - 9781424421855
T3 - International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT
SP - 2456
EP - 2459
BT - ICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings
ER -