Converting the infrared thermal image into temperature field for detection the defects inside materials

Terry Y. Chen, Ming Hsuan Kuo

研究成果: Conference contribution

4 引文 斯高帕斯(Scopus)

摘要

Infrared thermography inspection is a full-field, non-contact method that allows the defects inside the materials to be detected at one time. However, an interface is required to transfer the gray-level represented infrared image into temperature field for further evaluation. Based on the theory of radiation and the principle of infrared camera's signal conversion, a method to convert the gray level represented infrared thermal image into temperature field is developed. Test of the method on a cup of hot water was done. The temperature obtained by the proposed method and a commercial ones agree very well with each other. An average error less than 0.9% was achieved between them.

原文English
主出版物標題Eighth International Symposium on Precision Engineering Measurements and Instrumentation
DOIs
出版狀態Published - 2013 4月 12
事件8th International Symposium on Precision Engineering Measurements and Instrumentation - Chengdu, China
持續時間: 2012 8月 82012 8月 11

出版系列

名字Proceedings of SPIE - The International Society for Optical Engineering
8759
ISSN(列印)0277-786X

Other

Other8th International Symposium on Precision Engineering Measurements and Instrumentation
國家/地區China
城市Chengdu
期間12-08-0812-08-11

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 凝聚態物理學
  • 電腦科學應用
  • 應用數學
  • 電氣與電子工程

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