Cooling enhancement of electronic packages by modified barriers

J. H. Chou, M. C. Chen, J. Lee, Z. I. Fuu

研究成果: Paper

摘要

An experimental investigation has been conducted to study the merit and the physical mechanism involved in using barriers as local heat transfer promoters for an array of ninety simulated LSI packages. Both heat transfer coefficients and pressure drop coefficients were measured by an infrared thermal imaging radiometer and surface pressure tabs, respectively. The results indicate that thick modified barriers with a proper opening ratio will increase the local heat transfer coefficient and decrease the overall pressure loss coefficient. This is due to the formation of large scale horseshoe vortex and the fact that flow has more passage. Also thin modified barriers will have even larger local heat transfer coefficient due to its larger vortex structure.

原文English
頁面673-678
頁數6
出版狀態Published - 1993 十二月 1
事件Proceedings of the ASME International Electronics Packaging Conference. Part 2 (of 2) - Binghamton, NY, USA
持續時間: 1993 九月 291993 十月 2

Other

OtherProceedings of the ASME International Electronics Packaging Conference. Part 2 (of 2)
城市Binghamton, NY, USA
期間93-09-2993-10-02

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Mechanical Engineering

指紋 深入研究「Cooling enhancement of electronic packages by modified barriers」主題。共同形成了獨特的指紋。

  • 引用此

    Chou, J. H., Chen, M. C., Lee, J., & Fuu, Z. I. (1993). Cooling enhancement of electronic packages by modified barriers. 673-678. 論文發表於 Proceedings of the ASME International Electronics Packaging Conference. Part 2 (of 2), Binghamton, NY, USA, .