Copper underpotential deposition on gold in the presence of polyethylene glycol and chloride

Yong Da Chiu, Wei Ping Dow, Yung Fang Liu, Yuh-Lang Lee, Shueh Lin Yau, Su Mei Huang

研究成果: Article同行評審

11 引文 斯高帕斯(Scopus)

摘要

Many articles have shown that polyethylene glycol (PEG), when combined with chloride ions, is a strong suppressor of copper overpotential deposition (OPD) on a copper substrate. However, few articles have explored the roles of PEG and chloride ions in copper underpotential deposition (UPD) when the cathodic substrate was polycrystalline gold. The individual roles and the interactions of PEG and chloride ions during Cu UPD on a polycrystalline gold electrode were characterized using cyclic voltammetry (CV). According to the CV patterns, a small amount of chloride ions strongly facilitated the Cu UPD at a more positive potential; PEG alone exhibited a similar CV pattern to that of the additive-free case. PEG significantly promoted the accelerating effect of chloride ions on Cu UPD, a result that is the opposite of what occurred during Cu OPD. A mechanism by which PEG-Cl accelerates Cu UPD was proposed. This mechanism also indirectly suggests that the suppressor of Cu OPD should be PEG-Cu+-Cl, which could not form during Cu UPD on the polycrystalline gold electrode.

原文English
頁(從 - 到)3416-3426
頁數11
期刊International Journal of Electrochemical Science
6
發行號8
出版狀態Published - 2011 8月 1

All Science Journal Classification (ASJC) codes

  • 電化學

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