Correlation between Shadow Moiré and Micro Moiré techniques through characterization of flip-chip BGA

An Hong Liu, David W. Wang, Hsiang Ming Huang, Ming Sun, Muh Ren Lin, Chonghua Zhong, Sheng Jye Hwang, Hsuan Heng Lu, Huy Tien Bui, Shang Shiuan Deng

研究成果: Conference contribution

摘要

Although the reliability of chip-substrate interconnect joint has been well recognized by using leaded or lead-free solder bumps and Cu pillar, the relative displacement induced by package warpage between the bump and bump pad received significantly increasing interest, especially for those devices with low K materials and fine-pitch interconnects as the pitch becomes smaller and the package body size becomes larger in flip chip technology. In order to study the physical relationship between micron-level warpage of the package and nano-level displacement of the solder bumps, 1112-ball flip-chip BGA with and without a heat spreader was measured by using Shadow Moiré technique and Micro Moiré interferometry in this study. Shadow Moiré technique was used to characterize the overall warpage of the package between room temperature and solder ball reflow temperature of 230°C and Micro Moiré interferometry was used at room temperature and 114°C. From the results by Shadow Moiré, a heat spreader could alter the warpage pattern of the package from convex (w/o) to concave (w/o) and the amount of warpage was well-controlled under 16um. Furthermore, the correlations between Shadow Moiré and Micro Moiré were also described in this study. This study developed a useful approach and made direct estimations for the displacement of solder bumps to the possibility that could be contributive to the evaluation of the reliabilities of chip-level interconnects and packaging design.

原文English
主出版物標題2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011
頁面269-272
頁數4
DOIs
出版狀態Published - 2011 十二月 1
事件2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011 - Taipei, Taiwan
持續時間: 2011 十月 182011 十月 21

出版系列

名字Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
ISSN(列印)2150-5934
ISSN(電子)2150-5942

Other

Other2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011
國家/地區Taiwan
城市Taipei
期間11-10-1811-10-21

All Science Journal Classification (ASJC) codes

  • 硬體和架構
  • 控制與系統工程
  • 電氣與電子工程

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