Coupled Hygro-Thermo-Mechanical Analysis of Moisture Induced Interfacial Stresses in Fan-Out Package

Ji Yen Wu, Ting Wen Chen, Tz Cheng Chiu, Dao Long Chen, Tang Yuan Chen, Meng Kai Shih

研究成果: Conference contribution

摘要

For evaluating the hygro-thermo-mechanical reliability of fan-out (FO) wafer-level package, a coupled-field finite element (FE) model was developed to evaluate the moisture concentration and stresses at materials interfaces in a FO package structure. A series of moisture absorption experiments were first carried out on epoxy molding compound (EMC) under various temperature and relative humidity (RH) conditions. Material parameters for moisture absorption models including saturation concentration, diffusivity and coefficient of hygroscopic swelling (CHS) were obtained from fitting to the experimental results. These models were then implemented in a coupled FE simulation to estimate the evolutions of moisture concentration, package warpage and peel stresses at EMC-Si and polyimide (PI)-Cu interface corners under moisture sensitivity level (MSL) testing. The peel stresses were considered as the driving forces of the interface delaminations caused by moisture absorption. The experimentally fitted moisture diffusion model and the coupled hygro-thermo-mechanical simulation model established in this study can be used for evaluate the effects of geometry and materials on the moisture sensitivity of FO wafer level packages.

原文English
主出版物標題IMPACT 2019 - 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceeding
發行者IEEE Computer Society
頁面76-79
頁數4
ISBN(電子)9781728160702
DOIs
出版狀態Published - 2019 十月
事件14th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2019 - Taipei, Taiwan
持續時間: 2019 十月 232019 十月 25

出版系列

名字Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
2019-October
ISSN(列印)2150-5934
ISSN(電子)2150-5942

Conference

Conference14th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2019
國家/地區Taiwan
城市Taipei
期間19-10-2319-10-25

All Science Journal Classification (ASJC) codes

  • 硬體和架構
  • 控制與系統工程
  • 電氣與電子工程

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