Coupled power and thermal cycling reliability of board-level package-on-package stacking assembly

Tong Hong Wang, Yi Shao Lai, Chang Chi Lee, Yu-Cheng Lin

研究成果: Article同行評審

10 引文 斯高帕斯(Scopus)

摘要

In this paper, the sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, is performed to investigate thermal characteristics along with fatigue reliability of a board-level package-on-package (PoP) stacking assembly under coupled power and thermal cycling test conditions. Effects of powering sequences on thermal characteristics and fatigue reliability of the PoP are examined. The numerical analysis shows that coupled power and thermal cycling creates temperature excursions based on the thermal cycling profile. Also, reliability of the PoP is highly related to the range of temperature excursions and the degree of deviation of the temperature profile from the thermal cycling profile.

原文English
頁(從 - 到)14-21
頁數8
期刊IEEE Transactions on Electronics Packaging Manufacturing
32
發行號1
DOIs
出版狀態Published - 2009 1月 1

All Science Journal Classification (ASJC) codes

  • 工業與製造工程
  • 電氣與電子工程

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