Crackless linear through-wafer etching of Pyrex glass using liquid-assisted CO2 laser processing (Applied Physics A DOI: 10.1007/s00339-008- 4863-x)

C. K. Chung; Y. C. Sung; G. R. Huang; E. J. Hsiao; W. H. Lin; S. L. Lin

doi:10.1007/s00339-008-4949-5

Crackless linear through-wafer etching of Pyrex glass using liquid-assisted CO₂ laser processing (Applied Physics A DOI: 10.1007/s00339-008- 4863-x)

C. K. Chung
, Y. C. Sung
, G. R. Huang
, E. J. Hsiao
, W. H. Lin
, S. L. Lin

機械工程學系

研究成果: Comment/debate › 同行評審

1 引文斯高帕斯（Scopus）

原文	English
頁（從 - 到）	213
頁數	1
期刊	Applied Physics A: Materials Science and Processing
卷	94
發行號	1
DOIs	https://doi.org/10.1007/s00339-008-4949-5
出版狀態	Published - 2009 1月

All Science Journal Classification (ASJC) codes

一般化學
一般材料科學

存取文件

10.1007/s00339-008-4949-5

其它文件與鏈接

引用此

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