Creep-fatigue damage analysis of solder joints

S. H. Ju, S. Kuskowski, B. I. Sandor, M. E. Plesha

研究成果: Conference article同行評審

23 引文 斯高帕斯(Scopus)

摘要

An anisotropic model of continuum damage mechanics has been developed to predict the creep-fatigue life of solder joints. With the help of the finite element method, the stress, strain, and damage fields of the time-dependent and temperature-dependent solder can be obtained. The main advantages of this model include: (1) It can predict the initial crack location and time and the subsequent crack growth paths; (2) The damage analysis is almost the same as in traditional viscoelastic finite element analysis; (3) It can be applied to a complex structure with any loading; (4) It provides a full-field damage investigation of the structure. This damage theory can be used for various solder joints and also can be applied to analyze the creep-fatigue problems of other ductile and temperature-dependent materials. Extensive experiments including uniaxial creep, uniaxial fatigue, tension-torsion, Moire, and bimaterial tests were performed to validate the new model. These validations and comparisons indicate that this model can predict adequately crack growth paths and fatigue lives of solder joints.

原文English
頁(從 - 到)1-21
頁數21
期刊ASTM Special Technical Publication
發行號1153
DOIs
出版狀態Published - 1994 一月 1
事件Symposium on Fatigue of Electronic Materials - Atlanta, GA, USA
持續時間: 1993 五月 171993 五月 17

All Science Journal Classification (ASJC) codes

  • 工程 (全部)

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