Creep in a palladium-enriched high-copper amalgam

E. H. Greener, K. H. Chung, J. H.Chern Lin

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17 引文 斯高帕斯(Scopus)


Palladium additions to a dispersed phase high-copper amalgam have been shown recently to suppress markedly the η′ (Cu6Sn5) concentration and decrease creep. A detailed study of the dental and 24 h creep for Pd containing high-copper amalgams and six commercial controls as a function of applied temperature and stress was performed. One part of Ag-Cu or Ag-Cu-Pd dispersants with substitutions of up to 20 wt 0 Pd for either Ag or Cu was blended with two parts of traditional amalgam alloy. Various temperatures from 25 to 60°C and stresses from 36 to 72 MPa were applied to the samples during the test. For commercial controls and experimental amalgams with no Pd, creep is a strong function of temperature and stress. The experimental amalgam containing up to 10 wt 0 Pd, Pd substituted for Ag, demonstrated essentially constant creep over the temperature and stress range applied.

頁(從 - 到)213-217
出版狀態Published - 1988 5月

All Science Journal Classification (ASJC) codes

  • 生物物理學
  • 生物工程
  • 陶瓷和複合材料
  • 生物材料
  • 材料力學


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