Cu-based alloys for 3DP by melt extrusion process

C. S. Chou, W. C.J. Wei, Bernard Haochih Liu, A. B. Wang, R. C. Luo

研究成果: Conference contribution

摘要

A feasible method to extrude Cu-based alloys by a high-temperature melt-extrusion (ME) module and the property characterization of Cu-Zn alloys were conducted. The ME module assembled on 3D Printer (3DP) had different designs from traditional 3DP. The module for 3DP applications has superior characteristics, such as 1100oC-extrusion capability, high heating rate (930 oC/ 5 min), good thermal insulation, compact and light weight. Various Cu-based alloys, i.e. Cu-Zn alloys, were selected and prepared as the feedstock filaments for the ME 3DP. Oxidation kinetics of 8020 Cu-Zn alloy, pure Cu, and other metallic alloys were investigated and compared to that in N2 atmosphere. Besides, the electric conductivity is reported and discussed.

原文English
主出版物標題Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016
發行者Institute of Electrical and Electronics Engineers Inc.
頁面1152-1157
頁數6
ISBN(電子)9781467380751
DOIs
出版狀態Published - 2016 五月 19
事件IEEE International Conference on Industrial Technology, ICIT 2016 - Taipei, Taiwan
持續時間: 2016 三月 142016 三月 17

出版系列

名字Proceedings of the IEEE International Conference on Industrial Technology
2016-May

Other

OtherIEEE International Conference on Industrial Technology, ICIT 2016
國家Taiwan
城市Taipei
期間16-03-1416-03-17

All Science Journal Classification (ASJC) codes

  • Computer Science Applications
  • Electrical and Electronic Engineering

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