TY - GEN
T1 - Cu-based alloys for 3DP by melt extrusion process
AU - Chou, C. S.
AU - Wei, W. C.J.
AU - Liu, B. H.
AU - Wang, A. B.
AU - Luo, R. C.
N1 - Publisher Copyright:
© 2016 IEEE.
Copyright:
Copyright 2017 Elsevier B.V., All rights reserved.
PY - 2016/5/19
Y1 - 2016/5/19
N2 - A feasible method to extrude Cu-based alloys by a high-temperature melt-extrusion (ME) module and the property characterization of Cu-Zn alloys were conducted. The ME module assembled on 3D Printer (3DP) had different designs from traditional 3DP. The module for 3DP applications has superior characteristics, such as 1100oC-extrusion capability, high heating rate (930 oC/ 5 min), good thermal insulation, compact and light weight. Various Cu-based alloys, i.e. Cu-Zn alloys, were selected and prepared as the feedstock filaments for the ME 3DP. Oxidation kinetics of 8020 Cu-Zn alloy, pure Cu, and other metallic alloys were investigated and compared to that in N2 atmosphere. Besides, the electric conductivity is reported and discussed.
AB - A feasible method to extrude Cu-based alloys by a high-temperature melt-extrusion (ME) module and the property characterization of Cu-Zn alloys were conducted. The ME module assembled on 3D Printer (3DP) had different designs from traditional 3DP. The module for 3DP applications has superior characteristics, such as 1100oC-extrusion capability, high heating rate (930 oC/ 5 min), good thermal insulation, compact and light weight. Various Cu-based alloys, i.e. Cu-Zn alloys, were selected and prepared as the feedstock filaments for the ME 3DP. Oxidation kinetics of 8020 Cu-Zn alloy, pure Cu, and other metallic alloys were investigated and compared to that in N2 atmosphere. Besides, the electric conductivity is reported and discussed.
UR - http://www.scopus.com/inward/record.url?scp=84974573728&partnerID=8YFLogxK
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U2 - 10.1109/ICIT.2016.7474918
DO - 10.1109/ICIT.2016.7474918
M3 - Conference contribution
AN - SCOPUS:84974573728
T3 - Proceedings of the IEEE International Conference on Industrial Technology
SP - 1152
EP - 1157
BT - Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - IEEE International Conference on Industrial Technology, ICIT 2016
Y2 - 14 March 2016 through 17 March 2016
ER -