Current induced segregation of intermetallic compounds in three-dimensional integrated circuit microbumps

Chiao Wen Chen; Tsung Chieh Chiu; Ying Ta Chiu; Chiu Wen Lee; Kwang Lung Lin

doi:10.1016/j.intermet.2017.02.012

Current induced segregation of intermetallic compounds in three-dimensional integrated circuit microbumps

Chiao Wen Chen, Tsung Chieh Chiu, Ying Ta Chiu, Chiu Wen Lee, Kwang Lung Lin

研究成果: Article › 同行評審

15 引文斯高帕斯（Scopus）

摘要

Electromigration will induce polarity effects on the formation and dissolution of intermetallic compounds (IMCs) at the electrodes in conventional solder joints. However, the entire solder joint of a microbump may convert to intermetallic compounds after prolonged current stressing. The present study investigated the growth behavior of intermetallic compounds in a 30 μm height Sn1.8Ag microbump plated on a Cu pillar with or without an intermediate Ni layer when the substrate metallization was either Organic Solderability Preservative-Cu (OSP-Cu) or Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG). The progress of the growth of the intermetallic compounds under a current density of 1.0 × 10⁴ A/cm² was investigated for up to 300 h. The segregation and growth of the intermetallic compounds revealed by a three-dimensional cross section during current stressing was observed and discussed.

原文	English
頁（從 - 到）	117-124
頁數	8
期刊	Intermetallics
卷	85
DOIs	https://doi.org/10.1016/j.intermet.2017.02.012
出版狀態	Published - 2017 6月 1

All Science Journal Classification (ASJC) codes

化學 (全部)
材料力學
機械工業
金屬和合金
材料化學

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10.1016/j.intermet.2017.02.012

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abstract = "Electromigration will induce polarity effects on the formation and dissolution of intermetallic compounds (IMCs) at the electrodes in conventional solder joints. However, the entire solder joint of a microbump may convert to intermetallic compounds after prolonged current stressing. The present study investigated the growth behavior of intermetallic compounds in a 30 μm height Sn1.8Ag microbump plated on a Cu pillar with or without an intermediate Ni layer when the substrate metallization was either Organic Solderability Preservative-Cu (OSP-Cu) or Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG). The progress of the growth of the intermetallic compounds under a current density of 1.0 × 104 A/cm2 was investigated for up to 300 h. The segregation and growth of the intermetallic compounds revealed by a three-dimensional cross section during current stressing was observed and discussed.",

author = "Chen, {Chiao Wen} and Chiu, {Tsung Chieh} and Chiu, {Ying Ta} and Lee, {Chiu Wen} and Lin, {Kwang Lung}",

note = "Funding Information: The authors would like to thank the Ministry of Science and Technology, Taiwan, for the financial support of the study under grant MOST 104-2221-E-006-028-MY3. The supply of the microbump products and the assistance in electromigration test from Advanced Semiconductor Engineering (ASE) are acknowledged. Publisher Copyright: {\textcopyright} 2017 Elsevier Ltd",

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AU - Chiu, Ying Ta

AU - Lee, Chiu Wen

AU - Lin, Kwang Lung

N1 - Funding Information: The authors would like to thank the Ministry of Science and Technology, Taiwan, for the financial support of the study under grant MOST 104-2221-E-006-028-MY3. The supply of the microbump products and the assistance in electromigration test from Advanced Semiconductor Engineering (ASE) are acknowledged. Publisher Copyright: © 2017 Elsevier Ltd

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N2 - Electromigration will induce polarity effects on the formation and dissolution of intermetallic compounds (IMCs) at the electrodes in conventional solder joints. However, the entire solder joint of a microbump may convert to intermetallic compounds after prolonged current stressing. The present study investigated the growth behavior of intermetallic compounds in a 30 μm height Sn1.8Ag microbump plated on a Cu pillar with or without an intermediate Ni layer when the substrate metallization was either Organic Solderability Preservative-Cu (OSP-Cu) or Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG). The progress of the growth of the intermetallic compounds under a current density of 1.0 × 104 A/cm2 was investigated for up to 300 h. The segregation and growth of the intermetallic compounds revealed by a three-dimensional cross section during current stressing was observed and discussed.

AB - Electromigration will induce polarity effects on the formation and dissolution of intermetallic compounds (IMCs) at the electrodes in conventional solder joints. However, the entire solder joint of a microbump may convert to intermetallic compounds after prolonged current stressing. The present study investigated the growth behavior of intermetallic compounds in a 30 μm height Sn1.8Ag microbump plated on a Cu pillar with or without an intermediate Ni layer when the substrate metallization was either Organic Solderability Preservative-Cu (OSP-Cu) or Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG). The progress of the growth of the intermetallic compounds under a current density of 1.0 × 104 A/cm2 was investigated for up to 300 h. The segregation and growth of the intermetallic compounds revealed by a three-dimensional cross section during current stressing was observed and discussed.

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Current induced segregation of intermetallic compounds in three-dimensional integrated circuit microbumps

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