Data Mining for Delamination Diagnosis in the Semiconductor Assembly Process

Shao Yen Hung, Yung Lun Lin, Chia-Yen Lee

研究成果: Article

2 引文 (Scopus)

摘要

The delamination in die-attach layer is a problem that results in defects of semiconductor products. There are several elements and parameters, which are difficultly observed, causing delamination during the assembly process. Thus, it's critical to identify abnormal factors immediately for the real-time correction and improvement. This paper proposes a two-stage analysis framework to achieve two goals: identifying the key factors affecting delamination via variable selection and predicting the ratio of the delamination area in a die via the prediction models.

原文English
頁(從 - 到)1976-1983
頁數8
期刊Procedia Manufacturing
11
DOIs
出版狀態Published - 2017 一月 1

指紋

Delamination
Data mining
Semiconductor materials
Defects

All Science Journal Classification (ASJC) codes

  • Artificial Intelligence
  • Industrial and Manufacturing Engineering

引用此文

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Data Mining for Delamination Diagnosis in the Semiconductor Assembly Process. / Hung, Shao Yen; Lin, Yung Lun; Lee, Chia-Yen.

於: Procedia Manufacturing, 卷 11, 01.01.2017, p. 1976-1983.

研究成果: Article

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