Deep nickel metal deposition on multiscale feature sizes of a small hole and large sector cavities using electroforming

Chen-Kuei Chung, Wei Tse Chang

研究成果: Article同行評審

摘要

The deep nickel metal deposition on multiscale features with a single small hole and large sector cavities with depth of 1 mm has been investigated using direct current (DC) and pulse alternating current (AC) electroforming. The diameter of the hole is around 240 μm, and the size of the sector cavity is several mm to cm corresponding to the various aspect ratios from 0.07 to 4.17. The successful metal electroforming into both the hole and cavity features can be obtained by the AC mode, while the DC mode leads to metal electroforming only in sector cavities rather than in the small hole. This is because the surface concentration of the cathode in pulse electroforming is higher than that in DC electroforming, allowing large cations to diffuse into different multiscale features at lower overpotential. The increment factor, i.e., percentage increase in concentration used as an index of the varied surface concentration increases from 0.903 (10-2%) at 1 Hz to 1.077 (10-2%) at 100 Hz. This achievement can be used for the high aspect ratio metal electroforming of a single hole as a micro-sensing tip in different applications.

原文English
文章編號021111
期刊Journal of Micro/Nanolithography, MEMS, and MOEMS
8
發行號2
DOIs
出版狀態Published - 2009 1月 1

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 原子與分子物理與光學
  • 凝聚態物理學
  • 機械工業
  • 電氣與電子工程

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