Demonstration of Superconducting Interconnects on the Silicon Interconnect Fabric Using Thermocompression Bonding

Yu Tao Yang, Chaowei Hu, Jazmine Green, Peng Zhang, Niloofar Shakoorzadeh, Pranav Ambhore, Umesha Mogera, Ni Ni, Kang L. Wang, Subramanian S. Iyer

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

In this paper, the silicon interconnect fabric (Si-IF) technology is extended to superconducting electronics using niobium (Nb) as the superconducting interconnect (Superconducting-IF). It has advantages of solderless metal- metal interconnects, fine pitch integration (≤ 10 μm), no complex packaging, an inter-dielet spacing of <100 μm, high bandwidth, low latency, low power generation and low power dissipation. In this platform, superconductor, Nb, is used as the interconnect material and a low-temperature Au-Au thermocompression bonding at 140°C that retains the transition temperature is established. Au-Au bonding was first studied and optimized through shear strength tests using a blanket structure. The average shear force obtained was >100 N over 2×2 mm2 dies. The optimized parameters are: a 3-min Ar plasma surface pre-bonding clean, a bonding temperature of 140°C, at a bonding pressure of 35 MPa for a duration of 1.5 s followed by a post-bond annealing duration of 2 min at 140°C. A Kelvin test structure was fabricated to measure the superconductivity of Nb before and after each process. Under all processing conditions, the transition temperature of Nb remained at 9 K The resistance of Nb interconnects with Au thin-film bonding sites approached zero below the transition temperature of 9 K.

原文English
主出版物標題Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020
發行者Institute of Electrical and Electronics Engineers Inc.
頁面1861-1866
頁數6
ISBN(電子)9781728161808
DOIs
出版狀態Published - 2020 六月
事件70th IEEE Electronic Components and Technology Conference, ECTC 2020 - Orlando, United States
持續時間: 2020 六月 32020 六月 30

出版系列

名字Proceedings - Electronic Components and Technology Conference
2020-June
ISSN(列印)0569-5503

Conference

Conference70th IEEE Electronic Components and Technology Conference, ECTC 2020
國家United States
城市Orlando
期間20-06-0320-06-30

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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